NGA Series
Non-Isolated Wide Input DC/DC Converters
PACKAGE SPECIFICATIONS (continued)
MECHANICAL DIMENSIONS - DIP PACKAGE
6
0.874±0.020 (22.19±0.50)
0.846 (21.49)
5*
4
RECOMMENDED FOOTPRINT
3
2
0.825 (20.96)
7
1*
0.267 (6.77) MAX
0.222±0.020
(5.65±0.50 )
All dimensions in inches ±0.01 (mm ±0.25mm).
All pins on a 0.1 (2.54) pitch and within 0.01 (0.25) of true position.
0.010±0.002
(0.25±0.05)
0.161±0.020
(4.10±0.50)
PIN CONNECTIONS
0.753 (19.14)
0.020±0.002 (0.50±0.05)
Pin
Function
0.400
(10.16)
7
6
1*
2
3
4
5*
0.213 (5.41)
0.100 (2.54)
1*
2
3
4
5*
6
SD
+V IN
COMMON
+V OUT
V ADJ
NC
7
Weight: 4.0g
NC
All dimensions in inches ±0.01 (mm ±0.25mm) except where stated otherwise.
All pins on a 0.1 (2.54) pitch and within 0.01 (0.25) of true position.
* Optional pins available on NGA10S15050DEC only
RoHS COMPLIANCE INFORMATION
This series is compatible with RoHS soldering systems with a peak wave solder temperature of 300oC for 10 seconds. The pin
termination ?nish on the SIP package type is Tin Plate, Hot Dipped over Matte Tin with Nickel Preplate and Tin on the DIP types.
Both types in this series are backward compatible with Sn/Pb soldering systems.
For further information, please visit www.murata-ps.com/rohs
www.murata-ps.com
Technical enquiries email: mk@murata-ps.com, tel: +44 (0)1908 615232
2013-01-24
KDC_NGAC.F03 Page 5 of 6
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